Two-point bonding measurements test equalizing the potentials between metallic items.

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The test is about making sure metallic items share the same electrical potential. Bonding accomplishes this by creating a continuous conductive path between all relevant metal components so they effectively become one equipotential network. When two metal items are bonded, a fault current on one path will rapidly spread across the bonded path rather than creating a dangerous voltage difference at a touch point. This is why two-point bonding measurements look for a very low impedance connection between the items, indicating they are at the same potential.

Grounding, by contrast, ties the system to earth to establish a reference potential and provide a fault path to ground. Shielding and insulation protect against interference or prevent current flow, but they do not ensure equal potential between metallic items in the way bonding does.